SiO2-CaO-Al2O3 glass solder for joining of Al2O3 to Al2O3

High Temperature Materials and Processes

Volumn 17, Issue 4, 1998, Pages 209-216

  Ahn, B G ^a   Shiraishi, Y ^b  

^a Chonbuk National University   (South Korea)

^b AGNE Gijutsu Center Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BENDING STRENGTH; CERAMIC MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); JOINING; LIME; SCANNING ELECTRON MICROSCOPY; SILICA; SOLDERED JOINTS; THERMAL EFFECTS; WETTING;

FOUR POINT BENDING TEST; GLASS SOLDERS;

GLASS;

EID: 0032178647     PISSN: 03346455     EISSN: None     Source Type: Journal    
DOI: 10.1515/HTMP.1998.17.4.209     Document Type: Article

References (7)

1. B.-G. Ahn and Y. Shiraishi, Tohoku Daigaku Senken Iho, 45, 77 (1989).
2. C.E. Scott and J.A. Brewer, J. Am. Ceram. Soc., 69, c178 (1986)
3. G. Elssner, W. Diem and J.S. Wallace, in: Surfaces and Interfaces in Ceramics and Ceramic-Metal Systems, J.A. Pask and A.G. Evans (eds.), Plenum Press, 1981.
4. H. Takashiro, Yogyokyokai-shi, 84, 548 (1976).
5. K. Sakata, K. Honma, K. Ogawa, O. Watanabe and Kn. Nii, Nippon Kinzoku Gakkai-shi, 49, 540 (1985).
6. B.-G. Ahn, Y. Okamoto, S. Watanabe and Y. Shiraishi, Tohoku Daigaku Senken Iho, 47, 86 (1991).
7. K. Takahashi, Yogyokyokai-shi, 63, 142 (1955).