Micromachining of tin oxide film by electrochemical reduction process

Journal of the Electrochemical Society

Volumn 145, Issue 9, 1998, Pages 3067-3069

  Matsuo, Y ^a   Hashimoto, K ^a   Sugie, Y ^a   Nakamura, T ^b   Tsunoda, J ^b  

^a UNIVERSITY OF HYOGO   (Japan)

^b Joyo Company Limited   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROLYTES; ETCHING; MICROMACHINING; PHOTOLITHOGRAPHY; PLATINUM; REDUCTION; TIN COMPOUNDS;

TIN OXIDE;

ELECTROCHEMICAL ELECTRODES;

EID: 0032166798     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838765     Document Type: Article

References (10)

1. T. Hayashi and H. Tsukamoto, Jpn. J. Appl. Phys., 12, 1457 (1973).
2. B. K. Smith, U.S. Pat. 3,210,214 (1965).
3. R. E. Lake and C. West, U.S. Pat. 3,489,624 (1970).
4. H. B. Bullinger, U.S. Pat. 3,615,465 (1971).
5. E. W. Chase and H. J. Robinson, U.S. Pat. 3,668,089 (1972).
6. H. S. Cole, U.S. Pat, 3,837,944 (1974).
7. P. W. Simon, U.S. Pat. 4,009,061 (1975).
8. R. Muto and S. Furuuchi, Rep. Res. Lab. Asahi Glass Co. Ltd., 23, 27 (1973).
9. B. J. Baliga and S. K. Ghandhi, J. Electrochem. Soc., 124, 1059 (1977).
10. K. Miyazawa, Kinzoku Hyomen Gijutsu, 286, 34 (1983).