Electrodeposition of copper and copper-aluminum alloys from a room-temperature chloroaluminate molten salt

Journal of the Electrochemical Society

Volumn 145, Issue 9, 1998, Pages 3110-3116

  Tierney, Brian J ^a   Pitner, William R ^a   Mitchell, John A ^a   Hussey, Charles L ^a   Stafford, Gery R ^b  

^a UNIVERSITY OF MISSISSIPPI   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; COMPOSITION EFFECTS; COPPER; COPPER ALLOYS; CRYSTAL ATOMIC STRUCTURE; MOLTEN MATERIALS; MORPHOLOGY; REDUCTION; SALTS; SURFACE STRUCTURE; X RAY CRYSTALLOGRAPHY;

FACE-CENTERED CUBIC (FCC) STRUCTURE; ROTATING RING-DISK ELECTRODE VOLTAMMETRY;

ELECTRODEPOSITION;

EID: 0032165780     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838772     Document Type: Article

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