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Volumn 38, Issue 11, 1998, Pages
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Thermocouple attachment for reflow solder profiling and process development
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
FLIP CHIP DEVICES;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT DESIGN;
PRINTED CIRCUIT MANUFACTURE;
SOLDERING;
SURFACE MOUNT TECHNOLOGY;
TEMPERATURE;
THERMOCOUPLES;
ADHESIVE TAPE;
BALL GRID ARRAY;
HIGH TEMPERATURE SOLDERING;
REFLOW SOLDER PROFILING;
THERMAL CONTACT;
ELECTRONICS PACKAGING;
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EID: 0032164824
PISSN: 00134945
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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