3-D FEM/BEM-hybrid modeling of surface mounted devices within planar circuits

IEEE Transactions on Microwave Theory and Techniques

Volumn 46, Issue 9, 1998, Pages 1334-1336

  Eibert, T F ^a   Hansen, V ^b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

Capacitors; Finite element methods; Integral equations; Nonhomogeneous media

Indexed keywords

BOUNDARY ELEMENT METHOD; CAPACITORS; CURRENT DENSITY; FINITE ELEMENT METHOD; GREEN'S FUNCTION; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICE STRUCTURES;

MICROSTRIP CIRCUITS; SURFACE INTEGRAL EQUATION; SURFACE MOUNTED DEVICES;

SURFACE MOUNT TECHNOLOGY;

EID: 0032163572     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.709485     Document Type: Article

References (3)

1. M.-J. Tsai, C. Chen, N. G. Alexopoulos, and T.-S. Horng, "Multiple arbitrary shape via-hole and air-bridge transitions in multilayered structures," IEEE Trans. Microwave Theory Tech., vol. 44, pp. 2504-2511, Dec. 1996.
2. T. F. Eibert and V. Hansen, "3D FEM/BEM-Hybrid approach for planar layered media," Electromagn., vol. 16, no. 3, pp. 253-272, May/June 1996.
3. _, "3-D FEM/BEM-Hybrid approach based on a general formulation of Huygens' principle for planar layered media," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1105-1112, July 1997.