Automated Inspection of Solder Joints -A Neural Network Approach

European Journal of Mechanical and Environmental Engineering

Volumn 43, Issue 3, 1998, Pages 129-135

  Sankaran, Vijay ^a   Chartrand, Brent ^a   Millard, Don L ^a   Embrechts, Mark J ^a   Kraft, Russell P ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; AUTOMATION; DATA REDUCTION; IMAGE ANALYSIS; INSPECTION; NEURAL NETWORKS;

AUTOMATED INSPECTION;

SOLDERED JOINTS;

EID: 0032156617     PISSN: 00353612     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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8. Park, J-S. and Tou, J.T., "A Solder Joint Inspection System for Automated Printed Circuit Board Manufacturing," Proc. IEEE Int'l Conf. on Robotics and Automation, Cincinnati, OH, USA, pp. 1290-95, 1990.
9. Teoh, E.K., Mitai, D.P., Lee, B.P., and Wee, L.K., "Automated Visual Inspection of Surface Mount PCBS." 1990 IECON Proc., Pacific Grove, CA, USA, pp. 576-580. 1990.
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13. Sankaran, V. "A Methodology for Integrated Inspection of Printed Wiring Assemblies using Neural Networks," Ph.D. Thesis, Dept. Mechanical Engineering, Rensselaer Polytechnic Institute, Troy, NY, Aug. 1996.