Three-dimensional transient simulation of magnetoresistive head temperature during an ESD event

Journal of Electrostatics

Volumn 44, Issue 3-4, 1998, Pages 267-280

  Chang, Clifton ^a  

^a SEAGATE TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC DISCHARGES; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MAGNETIC HEADS; MAGNETORESISTANCE; PARAMETER ESTIMATION; TRANSIENTS;

ELECTROSTATIC DISCHARGE (ESD); MAGNETORESISTIVE HEADS;

ELECTROSTATICS;

EID: 0032156313     PISSN: 03043886     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0304-3886(98)00034-5     Document Type: Article

References (8)

1. A. Wallash, T. Hughbanks, S. Voldman, ESD failure mechanisms of inductive and magnetoresistive recording heads, EOS/ESD Symp. Proc. 1995, pp. 322–330.
2. N. Ishiwata T. Ishi H. Matsutera K. Yamada Narrow track MR head technology IEEE Trans. Magn. 32 1 1996 38 42
3. K. Young Finite element analysis of planar stress anisotropy and thermal behavior in thin films IBM J. Res. Dev. 34 5 1990 706 717
4. H. Tian J. Lee Electrostatic discharge damage of MR heads IEEE Trans. Magn. 31 6 1995 2624 2626
5. A. Jander R. Indeck J. Brug J. Nickel A model for predicting heating of magnetoresistive heads IEEE Trans. Magn. 32 5 1996 3392 3394
6. J. Himle Off-track testing to evaluate ESD damage to MR heads IEEE Trans. Magn. 32 5 1996 3455 3457
7. J. Smith, W. Littau, Prediction of thin-film resistor burnout, EOS/ESD Symp. Proc. 1981, pp. 192–197.
8. ANSYS, Inc., Canonsburg, PA.