Estimation of thermal shock fracture toughness of Si3N4

Journal of the Ceramic Society of Japan

Volumn 106, Issue 9, 1998, Pages 877-882

  Awaji, Hideo ^a   Takahashi, Toshifumi ^a   Yamamoto, Naoto ^a   Honda, Sawao ^a   Hirosaki, Naoto ^b  

^a NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

^b NISSAN MOTOR CO   (Japan)

Author keywords

Infrared radiation heating; Silicon nitride; Stress intensity factor; Thermal shock fracture toughness; Thermal shock test; Thermal stress

Indexed keywords

FRACTURE TOUGHNESS; HEAT FLUX; HEATING; INFRARED RADIATION; MATERIALS TESTING; MECHANICAL VARIABLES MEASUREMENT; STRENGTH OF MATERIALS; STRESS INTENSITY FACTORS; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS;

INFRARED RADIATION HEATING; THERMAL DIFFUSIVITY; THERMAL SHOCK FRACTURE TOUGHNESS; THERMAL SHOCK TEST; THIN CIRCULAR DISK;

SILICON NITRIDE;

EID: 0032155877     PISSN: 09145400     EISSN: None     Source Type: Journal    
DOI: 10.2109/jcersj.106.877     Document Type: Article

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