Mechanism of etch stop in high aspect-ratio contact hole etching

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 9 A, 1998, Pages 5060-5063

  Ohiwa, Tokuhisa ^a   Kojima, Akihiro ^a   Sekine, Makoto ^a   Sakai, Itsuko ^a   Yonemoto, Shigeru ^a   Watanabe, Yumi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Contact hole; Etch stop; Plasma etching; RIE; SiO2

Indexed keywords

ASPECT RATIO; CARBON; DEPOSITION; HOLE TRAPS; PLASMA COLLISION PROCESSES; SPUTTERING; TRANSPORT PROPERTIES;

CONTACT HOLE ETCHING; ETCH STOP;

PLASMA ETCHING;

EID: 0032154604     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.5060     Document Type: Article

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