Modeling a die bonder with petri nets: A case study

IEEE Transactions on Semiconductor Manufacturing

Volumn 11, Issue 3, 1998, Pages 404-409

  Janneck, Jörn W ^a   Naedele, Martin ^a,b  

^a ETH ZURICH   (Switzerland)

^b IEEE   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

DIE BONDERS; SOFTWARE PACKAGE CODESIGN;

COMPUTER AIDED MANUFACTURING; COMPUTER SIMULATION; OBJECT ORIENTED PROGRAMMING; PETRI NETS; SEMICONDUCTOR DEVICE MODELS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032140244     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.705375     Document Type: Article

References (12)

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