Interfacial stability of the As-Se-S/ZnS, As-Se-S/ZnSe, As-Se-Tl/ZnS, As-Se-Tl/ZnSe, and related systems

Journal of Non-Crystalline Solids

Volumn 231, Issue 3, 1998, Pages 240-250

  Shie, Bo Rung ^a   Chen, Sinn Wen ^a   Wang, Jinn Lung ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; COMPOSITION; DIFFUSION; GLASS; MICROSTRUCTURE; MOLTEN MATERIALS; MORPHOLOGY; STOICHIOMETRY; ZINC COMPOUNDS;

COMPOSITIONAL ANALYSIS; INTERFACIAL STABILITY; MOLTEN GLASS; REACTION COUPLE TECHNIQUE;

INTERFACES (MATERIALS);

EID: 0032140094     PISSN: 00223093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3093(98)00535-3     Document Type: Article

References (26)

1. R.H. Hopkins, W.E. Kramer, G.B. Brandt, J.S. Schruben, R.A. Hoffman, K.B. Steinbruegge, T.L. Peterson, J. Appl. Phys. 49 (6) (1978) 3133.
2. S.S. Flaschen, A.D. Pearson, W.R. Northover, J. Am. Ceram. Soc. 43 (5) (1960) 274.
3. M.F. Kotkata, M.M. Radwan, M.H. El-Fouly, S.A. Fayek, 25 (1990) 2107.
4. S.-W. Chen, M.-H. Lin, B.-R. Shie, J.-L. Wang, J. Non-Cryst. Solids, in print.
5. J.B. Clark, F.N. Rhines, AIME Trans. J. Met. 209 (1957) 6.
6. A.D. Romig Jr., Y.A. Chang, J.J. Stephens, D.R. Frear, V. Marcotte, C. Lea, in: D.R. Frear, W.B. Jones, K.R. Kinsman (Eds.), Solder Mechanics: A State of the Art Assessment, TMS, Warrendale, PA, 1991, p. 29.
7. R.J. Klein Wassink, Soldering in Electronics, 2nd ed., Electrochemical Publication, Isle of Man, 1994.
8. M. Schwartz, Brazing: For the Engineering Technologist, Chapman and Hall, London, 1995.
9. L.S. Castleman, L.L. Seigle, Trans. TMS-AIME (1958) 589.
10. G.V. Kidson, J. Nucl. Mater. 3 (1) (1961) 21.
11. M.M.P. Janssen, G.D. Rieck, Trans. TMS-AIME 239 (1967) 1372.
12. G. Wagner, Acta. Metall. 17 (1969) 99.
13. R.A. Rapp, A. Ezis, G.J. Yurek, Metall. Trans. 4 (1973) 1283.
14. M. Onishi, H. Fujibuchi, Trans. JIM 16 (1975) 539.
15. J.-C. Lin, K.J. Schulz, K.-C. Hsieh, Y.A. Chang, J. Electrochem. Soc. 136 (10) (1989) 3006.
16. F.J.J. van Loo, Progr. Solid State Chem. 20 (1990) 47.
17. Z. Mei, A.J. Sunwoo, J.W. Morris, Jr., Metall. Trans. A 23A (1992) 857.
18. C.-L. Tsao, S.-W. Chen, J. Mater. Sci. 30 (1995) 5215.
19. H.-T. Luo, S.-W. Chen, J. Mater. Sci. 31 (1996) 5059.
20. L.-H. Su, Y.-W. Yen, S.-W. Chen, Metall. Mater. Trans. B 28B (1997) 927.
21. S.K. Kang, V. Ramachandran, Scripta Metall. 14 (1980) 421.
22. D.R. Poirier, G.H. Geiger, Transport Phenomena in Materials Processing, TMS, Warrendale, PA, 1994, p. 463.
23. H. Okamoto, ASM Handbook, vol. 3: Binary Alloy Phase Diagrams, ASM International, Materials Park, Ohio, 1992, p. 2.62.
24. Idem, ibid, 1992, p. 2.65.
25. F.Y. Shiau, Y.A. Chang, Appl. Phys. Lett. 55 (15) (1989) 1510.
26. F.Y. Shiau, S.L. Chen, M. Loomans, Y.A. Chang, J. Mater. Res. 61 (7) (1991) 1532.