Low-cost AlGaAs/GaAs HBT multi-gigabit limiting amplifier packaged with a new plastic air tight cavity encapsulation process

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 3, 1998, Pages 309-313

  Kwark, Bongsin ^b   Ma, Dong Sung ^c   Seo, Hwachang ^c   Ham, Kisung ^d   Park, Moon Soo ^a,b  

^a IEEE

^b SAMSUNG Electronics   (South Korea)

^c Kukje Institute of Electronics Technology   (South Korea)

^d CTI Semiconductor Corporation   (South Korea)

Author keywords

AlGaAs HBT; Limiting amplifier; Optical receiver; Plastic package

Indexed keywords

BIT ERROR RATE; ELECTRONICS PACKAGING; ENCAPSULATION; EPOXY RESINS; HETEROJUNCTION BIPOLAR TRANSISTORS; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GALLIUM ARSENIDE;

LIMITING AMPLIFIERS;

DIFFERENTIAL AMPLIFIERS;

EID: 0032138547     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.704943     Document Type: Article

References (7)

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5. J. T. Kim, C. I. Park, and C. H. Lee, "A method making an air tight cavity in an assembly package and an assembly package made by the method," U.S. Patent 08 603 377, pp. 1-26., Feb. 20, 1996.
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7. J. T. Kim et al., "Plastic air cavity encapsulation process," in Tech. Dig. 1997 Int. Conf. GaAs Manufact. Technol., San Francisco, CA, 1997.