Electrochemical characterization of copper deposited on plasma and thermally modified titanium surfaces

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 29, Issue 4, 1998, Pages 749-754

  Teng, K S ^a   Delplancke, J L ^a,b   Zhang, J ^a   O'Keefe, T J ^b  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^b UNIVERSITÉ LIBRE DE BRUXELLES   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COPPER; HEAT TREATMENT; NUCLEATION; OXYGEN; PLASMA APPLICATIONS; PRESSURE EFFECTS; SUBSTRATES; SURFACE STRUCTURE; THERMAL EFFECTS; TITANIUM; TITANIUM DIOXIDE;

HOLE-FREE COPPER FOIL;

ELECTROMETALLURGY;

EID: 0032138321     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-998-0133-8     Document Type: Article

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