Simulations of cyclic, transient variations of mold temperatures in the SMC compression molding process

Polymer Composites

Volumn 19, Issue 4, 1998, Pages 311-324

  Sheng Yan, H U ^a   Chen, Shia Chung ^a   Twu, Jun Tien ^b   James Lee, L ^b  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b Ohio State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; HEAT TRANSFER; SHEET MOLDING COMPOUNDS; TEMPERATURE DISTRIBUTION; THERMAL CYCLING;

DUAL RECIPROCITY BOUNDARY ELEMENT TECHNIQUE;

COMPRESSION MOLDING;

EID: 0032131522     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.10104     Document Type: Article

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