메뉴 건너뛰기




Volumn 37, Issue 8, 1998, Pages 4277-4283

Formation of ultra-shallow and low-reverse-bias-current tantalum-silicided junctions using a Si-encapsulated silicidation technique and low-temperature furnace annealing below 550°C

Author keywords

Ion beam mixing; Ion implantation through metal; Low temperature processing; Point defects; Shallow junction; Silicon encapsulated silicidation; Substrate dopant concentration; Tantalum silicide

Indexed keywords

ANNEALING; FURNACES; ION IMPLANTATION; LEAKAGE CURRENTS; TANTALUM COMPOUNDS;

EID: 0032131409     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.4277     Document Type: Article
Times cited : (3)

References (42)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.