-
1
-
-
11644287243
-
Comparison of MESFET, HEMT, and HBT device performance at high temperature
-
K. Fricke, V. Krozer, and M. Schüßler, "Comparison of MESFET, HEMT, and HBT device performance at high temperature," in Proc. 3rd Int. High-Temperature Electronics Conf., 1996, pp. IV-15-IV-20.
-
(1996)
Proc. 3rd Int. High-Temperature Electronics Conf.
-
-
Fricke, K.1
Krozer, V.2
Schüßler, M.3
-
2
-
-
6244243306
-
Comparison of GaAs JFET's to MESFET's for high-temperature operation
-
J. C. Zolper, V. M. Hietala, M. S. Housel, A. G. Baca, and M. E. Sherwin, "Comparison of GaAs JFET's to MESFET's for high-temperature operation," in Proc. 3rd Int. High Temperature Electronics Conf., 1996, pp. IV-9-IV-14.
-
(1996)
Proc. 3rd Int. High Temperature Electronics Conf.
-
-
Zolper, J.C.1
Hietala, V.M.2
Housel, M.S.3
Baca, A.G.4
Sherwin, M.E.5
-
3
-
-
0028397565
-
Comparative behavior and performances of MESFET and HEMT as a function of temperature
-
Y. Gobert, G. Salmer, "Comparative behavior and performances of MESFET and HEMT as a function of temperature," IEEE Trans. Electron Devices, vol. 41, pp. 299-305, 1994.
-
(1994)
IEEE Trans. Electron Devices
, vol.41
, pp. 299-305
-
-
Gobert, Y.1
Salmer, G.2
-
4
-
-
0023965427
-
New MBE buffer used to eliminate backgating in GaAs MESFET's
-
Feb.
-
F. W. Smith, A. R. Calawa, C.-L. Chen, M. J. Manfra, and L. J. Mahoney, "New MBE buffer used to eliminate backgating in GaAs MESFET's," IEEE Electron Device Lett., vol. 9, pp. 77-80, Feb. 1988.
-
(1988)
IEEE Electron Device Lett.
, vol.9
, pp. 77-80
-
-
Smith, F.W.1
Calawa, A.R.2
Chen, C.-L.3
Manfra, M.J.4
Mahoney, L.J.5
-
5
-
-
0022216773
-
0.53 as lateral devices: A comparison
-
0.53 as lateral devices: A comparison," Inst. Phys. Conf. Ser., no. 74, pp. 581-587, 1985.
-
(1985)
Inst. Phys. Conf. Ser.
, Issue.74
, pp. 581-587
-
-
Zwicknagl, P.1
Mukherjee, S.D.2
Jones, W.L.3
Lee, H.4
Capani, P.M.5
Griem, T.6
Berry, J.D.7
Rathburn, L.8
Eastman, L.F.9
-
6
-
-
0020765850
-
Schottky barrier height variation with metallurgical reactions in Aluminum-Titanium-Gallium Arsenide contacts
-
Y. Wada and K.-I. Chino, "Schottky barrier height variation with metallurgical reactions in Aluminum-Titanium-Gallium Arsenide contacts," Solid State Electron., vol. 26, pp. 559-564, 1983.
-
(1983)
Solid State Electron.
, vol.26
, pp. 559-564
-
-
Wada, Y.1
Chino, K.-I.2
-
7
-
-
0029519242
-
Low temperature grown AlGaAs passivation in GaAs power MESFET
-
N. X. Nguyen, J. P. Ibbetson, W.-N. Jiang, and U. K. Mishra, "Low temperature grown AlGaAs passivation in GaAs power MESFET," in Proc. IEEE/Cornell Conf. Advanced Concepts in High Speed Semiconductor Devices and Circuits, 1995, pp. 269-277.
-
(1995)
Proc. IEEE/Cornell Conf. Advanced Concepts in High Speed Semiconductor Devices and Circuits
, pp. 269-277
-
-
Nguyen, N.X.1
Ibbetson, J.P.2
Jiang, W.-N.3
Mishra, U.K.4
-
8
-
-
0030387122
-
High temperature MESFET based integrated circuits operating up to 300 °C
-
J. Würfl, B. Janke, E. Nebauer, S. Thierbach, and P. Wolter, "High temperature MESFET based integrated circuits operating up to 300 °C," in IEDM Tech. Dig., 1996, pp. 219-222.
-
(1996)
IEDM Tech. Dig.
, pp. 219-222
-
-
Würfl, J.1
Janke, B.2
Nebauer, E.3
Thierbach, S.4
Wolter, P.5
-
9
-
-
0029486458
-
Low temperature grown GaAs materials and devices - Present status and trends
-
San Francisco, CA
-
E. Kohn and K.-M. Lipka, "Low temperature grown GaAs materials and devices - Present status and trends," in Proc. 1995 ISSSE (URSI), San Francisco, CA, pp. 107-110.
-
Proc. 1995 ISSSE (URSI)
, pp. 107-110
-
-
Kohn, E.1
Lipka, K.-M.2
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