Damage Boundary of a Packaging System under Rectangular Pulse Excitation

Packaging Technology and Science

Volumn 11, Issue 4, 1998, Pages 189-202

  Wang, Zhenlin ^a   Wu, Changfu ^a   Xi, Dechang ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Bilinear system; Cushioning; Damage boundary; Packaging dynamics; Product fragility

Indexed keywords

EID: 0032120756     PISSN: 08943214     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1522(199807/08)11:4<189::AID-PTS430>3.0.CO;2-7     Document Type: Article

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