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Volumn 15, Issue 3, 1998, Pages 28-34
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VLSI, MCM, and WSI: A design comparison
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Author keywords
[No Author keywords available]
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Indexed keywords
COST EFFECTIVENESS;
DIGITAL SIGNAL PROCESSING;
ELECTRONICS PACKAGING;
ENERGY UTILIZATION;
MICROPROCESSOR CHIPS;
MULTICHIP MODULES;
PRINTED CIRCUIT BOARDS;
SEMICONDUCTING SILICON;
SUBSTRATES;
VLSI CIRCUITS;
WSI CIRCUITS;
SUBSTRATE SIZE COST MODELS;
INTEGRATED CIRCUIT LAYOUT;
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EID: 0032120612
PISSN: 07407475
EISSN: None
Source Type: Journal
DOI: 10.1109/54.706030 Document Type: Review |
Times cited : (4)
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References (4)
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