|
Volumn 37, Issue 7, 1998, Pages 3871-3877
|
A new post-treatment for chemical-mechanical polishing process of very large-scale integrated circuit tungsten vias
a a a a a |
Author keywords
Chemical mechanical polishing; Contact resistance; Fluoroboric acid; Phosphoric acid; Planarization; Scrubbing; Sheet resistance; Tungsten via
|
Indexed keywords
ELECTRIC RESISTANCE;
SEMICONDUCTOR DEVICE MANUFACTURE;
TECHNOLOGY;
VLSI CIRCUITS;
PLANARIZATION;
SCRUBBING;
POLISHING;
|
EID: 0032117927
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.37.3871 Document Type: Article |
Times cited : (4)
|
References (15)
|