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Volumn 37, Issue 7, 1998, Pages 3871-3877

A new post-treatment for chemical-mechanical polishing process of very large-scale integrated circuit tungsten vias

Author keywords

Chemical mechanical polishing; Contact resistance; Fluoroboric acid; Phosphoric acid; Planarization; Scrubbing; Sheet resistance; Tungsten via

Indexed keywords

ELECTRIC RESISTANCE; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY; VLSI CIRCUITS;

EID: 0032117927     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.3871     Document Type: Article
Times cited : (4)

References (15)
  • 6
    • 3743121047 scopus 로고    scopus 로고
    • U.S. Patent 5078801 (1992)
    • F. A. Malik: U.S. Patent 5078801 (1992).
    • Malik, F.A.1
  • 8
    • 3743116575 scopus 로고    scopus 로고
    • U.S. Patent 5320706 (1994)
    • R. E. Blackwell: U.S. Patent 5320706 (1994).
    • Blackwell, R.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.