Microstructure characterization and effect of thermal cycling and ageing on vanadium-doped Cu-Al-Ni-Mn high-temperature shape memory alloy

Journal of Materials Science

Volumn 33, Issue 14, 1998, Pages 3579-3584

  Gao, Y ^a   Zhu, M ^a   Lai, J K L ^b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; DOPING (ADDITIVES); METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SHAPE MEMORY EFFECT; TEMPERATURE; THERMAL CYCLING; VANADIUM; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS;

COPPER ALUMINUM NICKEL MANGANESE ALLOY; ENERGY DISPERSIVE X RAY ANALYSIS; HIGH TEMPERATURE SHAPE MEMORY ALLOY; TRANSFORMATION TEMPERATURE;

COPPER ALLOYS;

EID: 0032109011     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004647127294     Document Type: Article

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