Solder transfer technique for flip-chip and electronic assembly applications

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 21, Issue 3, 1998, Pages 182-188

  Puttlitz, K J ^a   Stalter, K A ^a   Totta, P A ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDER TRANSFER TECHNIQUE;

ASSEMBLY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; TECHNOLOGY;

SOLDERING;

EID: 0032108512     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.720415     Document Type: Article

References (11)