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Volumn 60, Issue 5-6, 1998, Pages 615-623

Effect of a graded interlayer on the stress intensity factor of cracks in a joint under thermal loading

(4)  Bleeck, O a   Munz, D a   Schaller, W a   Yang, Y Y a  

a NONE

Author keywords

Functionally graded materials; Joints; Stress intensity factor; Thermal stresses

Indexed keywords

CRACK PROPAGATION; ELASTIC MODULI; INTERFACES (MATERIALS); STRESS INTENSITY FACTORS; THERMAL EFFECTS; THERMAL LOAD; THERMAL STRESS;

EID: 0032108312     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0013-7944(98)00044-7     Document Type: Article
Times cited : (30)

References (12)
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  • 2
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  • 3
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  • 4
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    • Cook T. S., Erdogan F. Stresses in bonded materials with a crack perpendicular to the interface. Int. J. Engng. Sci. 10:1972;677-697.
    • (1972) Int. J. Engng. Sci. , vol.10 , pp. 677-697
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    • Fett, T.1    Diegele, E.2    Munz, D.3    Rizzi, G.4
  • 6
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    • Two bonded half planes with a crack going through the interface
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    • Erdogan, F.1    Biricikoglu, V.2
  • 7
    • 0016507128 scopus 로고
    • On the stress intensity factors associated with cracks interacting with an interface between two elastic media
    • Atkinson C. On the stress intensity factors associated with cracks interacting with an interface between two elastic media. Int. J. Engng. Sci. 13:1975;489-504.
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  • 8
    • 0024863584 scopus 로고
    • Cracking of coated materials under transient thermal stresses
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  • 9
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    • On the stress intensity factors of cracks near an interface between two media
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  • 11
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.