Transient and steady-state thermal design evaluation of a carbon monoxide gas sensor using CFD tool

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 135-140

  Lee, T Y Tom ^a   Sharma, R ^a   Peyre Lavigne, A ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON MONOXIDE; COMPUTATIONAL FLUID DYNAMICS; ELECTRONICS PACKAGING; HEAT TRANSFER; THERMAL EFFECTS;

STEADY STATE THERMAL DESIGN;

CHEMICAL SENSORS;

EID: 0032097687     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792599     Document Type: Article

References (6)

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3. Lee, D.-D., Chung, W.-Y., Kim, T.-H., and Baek, J.-M., 1995a, “Low Power Micro Gas Sensor,”Proceedings of the 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX, Vol. 1, pp. 827-830.
4. Lee, T. Y., Chambers, B., and Mahalingam, M., 1995b, “Application of CFD Technology to Electronic Thermal Management,”IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 18, No. 3, pp. 511-520.
5. Paula, G., 1996, “MEMS Sensors Branch Out,” Mechanical Engineering, ASME, NY, pp. 64-68.
6. Ploss, B., Lienhard, D., and Sieber, F., 1995, “Thermal Simulation of Micromachined Bridges for Integrated Pyroelectric Sensor Array,”Microelectronics Engineering, Vol. 29, No. 1-4, pp. 75-78.