Electrodeposition of copper under microgravity conditions

Journal of the Electrochemical Society

Volumn 145, Issue 6, 1998, Pages 1876-1881

  Fukunaka, Y ^a   Okano, K ^a   Tomii, Y ^a   Asaki, Z ^a   Kuribayashi, K ^b  

^a KYOTO UNIVERSITY   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTROLYSIS; ELECTROLYTIC CELLS; GRAVITATIONAL EFFECTS; INTERFEROMETERS; MASS TRANSFER; MATHEMATICAL MODELS; MORPHOLOGY; SOLUTIONS; SURFACE STRUCTURE;

INTERFERENCE FRINGE PATTERN;

ELECTRODEPOSITION;

EID: 0032096926     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838570     Document Type: Article

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