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Journal of Materials Science

Volumn 33, Issue 11, 1998, Pages 2869-2874

Structure and strength of AIN/V bonding interfaces

(2) El Sayed, M H b,c Naka, M a

a OSAKA UNIVERSITY (Japan)

b OSAKA UNIVERSITY (Japan)

c CENTRAL METALLURGICAL RESEARCH AND DEVELOPMENT INSTITUTE CMRDI (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; BOND STRENGTH (MATERIALS); BONDING; DECOMPOSITION; METAL FOIL; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; VACUUM APPLICATIONS; VANADIUM; X RAY DIFFRACTION ANALYSIS;

ALUMINUM NITRIDE; ELECTRON PROBE MICROANALYSIS;

INTERFACES (MATERIALS);

EID: 0032089968 PISSN: 00222461 EISSN: None Source Type: Journal
DOI: 10.1023/a:1017546105704 Document Type: Article

Times cited : (8)

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