Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle

Sensors and Actuators, B: Chemical

Volumn 49, Issue 1-2, 1998, Pages 30-33

  Shiratori, Seimei Sha ^a   Mori, Seiji ^a   Ikezaki, Kazuo ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

Electropolymerization; Micro needle; Polypyrrole; Wire bonding

Indexed keywords

BONDING; CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC INSULATING MATERIALS; ELECTRIC WIRE; ELECTRODES; ELECTROPOLYMERIZATION; POLYPYRROLES; SUBSTRATES;

ELECTROCHEMICALLY POLYMERIZED POLYPYRROLE FILM; INSULATING SUBSTRATES; SCANNING MICRONEEDLE; WIRE BONDING;

ELECTROCHEMICAL SENSORS;

EID: 0032089803     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-4005(97)00338-9     Document Type: Article

References (5)

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3. S.S. Shiratori, S. Kuroda, K. Ikezaki, Formation of polypyrrole fine wires by electropolymerization LB technique (1st Asian Symposium on Organized Molecular Films for Electronics and Photonics (ASOMF1) October 28-30, Tsukuba Japan, 1996), Mol. Cryst. Liq. Cryst. 294 (1997) 27-30.
4. H. Naarmann, N. Theophilon, New process for the production of metal-like, stable polyacetylene, Synth. Metals 22 (1987) 1.
5. M. Sato, K. Kaneto, K. Yoshino, Dependence of electrical and mechanical properties of conducting polypyrrole films on conditions of electrochemical polymerization in an aqueous medium, Synth. Metals 14 (1986) 289.