The time of "guessing" your failure time distribution is over!

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 1187-1191

  Croes, K ^a   Manca, J V ^a   De Ceuninck, W ^a   De Schepper, L ^a   Molenberghs, G ^a  

^a HASSELT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; DATA REDUCTION; FAILURE ANALYSIS; RELIABILITY THEORY; WEIBULL DISTRIBUTION;

FAILURE TIME DISTRIBUTION; PEARSON'S CORRELATION COEFFICIENT;

MICROELECTRONICS;

EID: 0032083906     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00083-3     Document Type: Article

References (6)

1. 2 films thermally grown on a heavily doped Si substrate characterisation and modelling, IEEE Transactions on Electron Devices, Vol. 34 (1987), pp. 1540-1552
2. Bain, Statistical analysis of reliability and lifetesting models: theory and methods, Marcel Dekker Inc., New York, 1978
3. Lloyd, On the lognormal distribution of electromigration lifetimes, J. Appl. Phys., Vol. 50 (1979), pp. 5062-5064
4. Pinto, The effect of barrier layers on the distribution function of interconnect electromigration failures Qual. Reliab. Engin. Int., Vol. 7 (1991), pp. 287-291
5. LaCombe. and E.L. Parks, The distribution of electromigration failures, IEEE IRPS Proc. (1986), pp. 1-6
6. Failure '97, Software package for reliability data analysis distributed by DESTIN N.V., Wetenschapspark 1, B-3590 Diepenbeek, Belgium