Low temperature creep ductility of OFHC copper

Materials Science and Engineering: A

Volumn 246, Issue 1-2, 1998, Pages 143-150

  Henderson, P J ^a   Sandstrom R ^a  

^a SWEREA KIMAB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CREEP; DUCTILITY;

CREEP TESTING; DUCTILITY; FRACTURE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; LOW TEMPERATURE TESTING; SEGREGATION (METALLOGRAPHY); STRAIN RATE; SULFUR;

CREEP STRAIN; LOW TEMPERATURE CREEP DUCTILITY; OXYGEN FREE HIGH CONDUCTIVITY COPPER;

COPPER;

EID: 0032071933     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(97)00750-8     Document Type: Article

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