Thermal impedances of multi-finger heterojunction bipolar transistors

Solid-State Electronics

Volumn 42, Issue 5, 1998, Pages 865-869

  Anholt, R ^a  

^a Gateway Modeling Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; FLIP CHIP DEVICES;

THERMAL IMPEDANCES; THERMAL SHUNT;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 0032065985     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(98)00094-X     Document Type: Article

References (6)

1. Anholt, R., HBT thermal element design using an Electro/Thermal Simulator, Solid State Elect., 1998, 42, 849-855.
2. Anholt, R., FET and HEMT thermal impedances, Sol. State Elect., 1998, 42, 857-864.
3. Bayraktaroglu, B., Ali, F., Mason, J., Smith, P., IEEE MTT-S Digest, 1996, pp. 685-688.
4. Hill, D., Khatibzadeh, A., Liu, W., Kim, T. and Ikalainen, P., IEEE Micro. Guided Wave Lett., 1996, 6, 298.
5. Dettmer, R., Jenkins, T., Barrette, J., Bozada, C., DeSalvo, G., Ebel, J., Gillespie, J., Havasay, C., Ito, C., Nakano, K., Pettiford, C., Quach, T., Sewell, J., Via, D., Anholt, R., IEEE MTTS Digest, 1996, pp. 1196-1199.
6. Bayraktarolu, B., Barrette, J., Kehias, L., Huanh, C. I., Fitch, R., Neidhard, R. and Scherer, R., IEEE Elect. Dev. Lett., 1993, 14, 493-495.