Effect of Grinding on Strength of a Sintered Reaction-Bonded Silicon Nitride

InterCeram: International Ceramic Review

Volumn 47, Issue 3, 1998, Pages 168-173

  Ives, L K ^d   Jahanmir, S ^a,b,c   Gill, L M ^d   Filliben, J J ^d  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^c UNIVERSITY OF WASHINGTON   (United States)

^d University of Washington ^*

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CHEMICAL BONDS; CRYSTAL MICROSTRUCTURE; CRYSTAL STRUCTURE; GRINDING (MACHINING); HARDNESS; MECHANICAL VARIABLES MEASUREMENT; SINTERING; TENSILE PROPERTIES; TOUGHNESS;

FOUR POINT BEND FLEXURE SPECIMENS; GRIT SIZE; SINTERED REACTION BONDED SILICON NITRIDE;

SILICON NITRIDE;

EID: 0032064514     PISSN: 00205214     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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