Use of C-SAM acoustical microscopy in package evaluations and failure analysis

Microelectronics Reliability

Volumn 38, Issue 5, 1998, Pages 773-785

  Atkins, S ^a   Teems, L ^a   Rowe, W ^a   Selby, P ^a   Vaughters, R ^a  

^a INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; FAILURE ANALYSIS; MICROSCOPIC EXAMINATION; MOISTURE; SURFACE MOUNT TECHNOLOGY;

C-MODE SCANNING ACOUSTICAL MICROSCOPY (C-SAM);

ELECTRONICS PACKAGING;

EID: 0032064282     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00220-5     Document Type: Article

References (1)

1. Moore T M, Frank K A. 45th Electronic Components & Technology Conference, May 1995;:305-14.