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Volumn 38, Issue 5, 1998, Pages 870-877

Thermoplastic bonding to metals via injection molding for macro-composite manufacture

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FRACTURE; INTERFACES (MATERIALS); METALS; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; TENSILE STRENGTH; THERMOPLASTICS;

EID: 0032058034     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10253     Document Type: Article
Times cited : (96)

References (15)
  • 3
    • 0024888860 scopus 로고
    • Thermoplastic films for adhesive bonding hybrid microcircuit substrates
    • A. A. Shores, "Thermoplastic Films for Adhesive Bonding Hybrid Microcircuit Substrates," in 39th Electronic Components Conference, 39, (1989).
    • (1989) 39th Electronic Components Conference , vol.39
    • Shores, A.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.