A microscopic investigation of conducting filled polymers

Journal of Materials Science

Volumn 33, Issue 7, 1998, Pages 1715-1721

  Zweifel, Y ^a   Plummer, C J G ^a   Kausch, H H ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COMPUTER SIMULATION; CURING; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE MEASUREMENT; EPOXY RESINS; FILLERS; GOLD; POLYESTERS; SHRINKAGE; SILVER; VOLUME FRACTION;

CONDUCTING FILLED POLYMER; CURE IN SITU; PERCOLATION THRESHOLD;

CONDUCTIVE PLASTICS;

EID: 0032048063     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004316229497     Document Type: Article

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