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Volumn 145, Issue 4, 1998, Pages 1351-1355
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Impact of floating gate dopant concentration and interpoly dielectric processing on tunnel dielectric reliability
a,b a a a a,b a |
Author keywords
[No Author keywords available]
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Indexed keywords
AMORPHOUS SILICON;
ANNEALING;
CAPACITORS;
CHEMICAL VAPOR DEPOSITION;
ELECTRIC BREAKDOWN OF SOLIDS;
ELECTRIC CHARGE;
FILM GROWTH;
ION IMPLANTATION;
MOS DEVICES;
OXIDATION;
SEMICONDUCTOR DOPING;
FLOATING GATE DEVICES;
RAPID THERMAL CHEMICAL VAPOR DEPOSITION (RTCVD);
THERMAL BUDGET;
DIELECTRIC FILMS;
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EID: 0032046341
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1838464 Document Type: Article |
Times cited : (2)
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References (15)
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