High resolution temperature mapping of microelectronic structures using quantitative fluorescence microthermography

Microelectronics Journal

Volumn 29, Issue 4-5, 1998, Pages 163-170

  Herzum, C ^a   Boit, C ^a   Kolzer J ^a   Otto, J ^a   Weiland, R ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLUORESCENCE; MICROSCOPIC EXAMINATION; SEMICONDUCTOR DEVICE STRUCTURES; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

FLUORESCENCE MICROTHERMOGRAPHY; LIQUID CRYSTAL THERMOGRAPHY;

MICROELECTRONIC PROCESSING;

EID: 0032044652     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2692(97)00054-2     Document Type: Article

References (6)

1. Kolodner, P. and Tyson, J. Microscopic fluorescent imaging of surface temperature profiles with 0.01°C resolution, Appl. Phys. Lett., 409 (1982) 782.
2. Kolodner, P. and Tyson, J. Remote thermal imaging with 0.7-μm spatial resolution using temperature-dependent fluorescent thin films, Appl. Phys. Lett., 421 (1983) 117.
3. Barton, D.L. Fluorescent microthermographic imaging, Proc. 20th ISTFA, Los Angeles, CA, 1994, p. 87.
4. Bruce, V.J. Comparison of fluorescent microthermography to other commercially available techniques, Proc. 20th ISTFA, Los Angeles, CA, 1994, p. 73.
5. Hecht, E. Optics, 2nd edn, Addison-Wesley, London, 1977, Chapter 10.2.
6. Kölzer, J., Osterschulze, E. and Deboy, G. Thermal imaging and measurement techniques for electronic materials and devices, Microelectronic Eng., 31 (1996) 251-270.