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Volumn 29, Issue 4-5, 1998, Pages 223-228
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Active thermography application for solder thickness measurement in surface mounted device technology
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
INFRARED RADIATION;
OPTICAL RESOLVING POWER;
PRINTED CIRCUIT BOARDS;
SOLDERING ALLOYS;
SPECIFIC HEAT;
SURFACES;
TEMPERATURE INDICATING CAMERAS;
THERMAL CONDUCTIVITY OF SOLIDS;
THERMOGRAPHY (TEMPERATURE MEASUREMENT);
THICKNESS MEASUREMENT;
INFRARED THERMOGRAPHIC CAMERA;
SOLDER THICKNESS;
TRANSIENT THERMAL RESPONSE;
SURFACE MOUNT TECHNOLOGY;
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EID: 0032043617
PISSN: 00262692
EISSN: None
Source Type: Journal
DOI: 10.1016/s0026-2692(97)00061-x Document Type: Article |
Times cited : (6)
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References (11)
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