메뉴 건너뛰기




Volumn 29, Issue 4-5, 1998, Pages 223-228

Active thermography application for solder thickness measurement in surface mounted device technology

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; INFRARED RADIATION; OPTICAL RESOLVING POWER; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; SPECIFIC HEAT; SURFACES; TEMPERATURE INDICATING CAMERAS; THERMAL CONDUCTIVITY OF SOLIDS; THERMOGRAPHY (TEMPERATURE MEASUREMENT); THICKNESS MEASUREMENT;

EID: 0032043617     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2692(97)00061-x     Document Type: Article
Times cited : (6)

References (11)
  • 4
    • 0042902860 scopus 로고
    • A thermal model for hybrid circuits
    • Casselman, G. and De Mey, G. A thermal model for hybrid circuits, Hybrid Circuits, 9 (1986) 9-13.
    • (1986) Hybrid Circuits , vol.9 , pp. 9-13
    • Casselman, G.1    De Mey, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.