-
1
-
-
8744308974
-
A Review on Direct Liquid Cooling Channel Flow with Single-Phase for Electronic Systems
-
G. P. Xu, C. P. Tso, and K. W. Tou, A Review on Direct Liquid Cooling Channel Flow with Single-Phase for Electronic Systems, J. Electron. Manufact., vol. 6, pp. 115-125, 1996.
-
(1996)
J. Electron. Manufact.
, vol.6
, pp. 115-125
-
-
Xu, G.P.1
Tso, C.P.2
Tou, K.W.3
-
2
-
-
0000207321
-
Liquid Cooling of Micro-electronics Devices by Free and Forced Convection
-
E. Baker, Liquid Cooling of Micro-electronics Devices by Free and Forced Convection, Microelectron. Reliability, vol. 11, pp. 213-232, 1972.
-
(1972)
Microelectron. Reliability
, vol.11
, pp. 213-232
-
-
Baker, E.1
-
3
-
-
0015605221
-
Liquid Immersion Cooling of Small Electronic Devices
-
E. Baker, Liquid Immersion Cooling of Small Electronic Devices, Microelectron. Reliability, vol. 12, pp. 163-173, 1973.
-
(1973)
Microelectron. Reliability
, vol.12
, pp. 163-173
-
-
Baker, E.1
-
4
-
-
0022751657
-
Convection Heat Transfer from Discrete Heat Sources in a Rectangular Channel
-
F. P. Incropera, J. S. Kerby, D. F. Moffatt, and S. Ramadhyani, Convection Heat Transfer from Discrete Heat Sources in a Rectangular Channel, Int. J. Heat Mass Transfer, vol. 29, pp. 1051-1058, 1986.
-
(1986)
Int. J. Heat Mass Transfer
, vol.29
, pp. 1051-1058
-
-
Incropera, F.P.1
Kerby, J.S.2
Moffatt, D.F.3
Ramadhyani, S.4
-
5
-
-
0025439499
-
Comparison of Predicted and Mesured Mixed Convection Heat Transfer from an Array of Discrete Sources in a Horizontal Rectangular Channel
-
H. V. Mahaney, F. P. Incropera, and S. Ramadhyani, Comparison of Predicted and Mesured Mixed Convection Heat Transfer from an Array of Discrete Sources in a Horizontal Rectangular Channel, Int. J. Heat Mass Transfer, vol. 33, pp. 1233-1245, 1990.
-
(1990)
Int. J. Heat Mass Transfer
, vol.33
, pp. 1233-1245
-
-
Mahaney, H.V.1
Incropera, F.P.2
Ramadhyani, S.3
-
6
-
-
0024903718
-
Enhancement of Critical Heat Flux from High Power Micro-electronics Heat Sources in a Flow Channel
-
R. K. Shah (ed.), ASME HTD
-
I. Mudawar and D. E. Maddox, Enhancement of Critical Heat Flux from High Power Micro-electronics Heat Sources in a Flow Channel, in R. K. Shah (ed.), Heat Transfer in Electronics, ASME HTD-vol. 3, pp. 51-58, 1989.
-
(1989)
Heat Transfer in Electronics
, vol.3
, pp. 51-58
-
-
Mudawar, I.1
Maddox, D.E.2
-
7
-
-
0027046960
-
Effects of Orientationon Criticai Heat Flux from Chip Arrays during Flow Boiling
-
T. C. William and A. Hiroyuki (eds.), ASME, New York
-
C. O. Gersey and I Mudawar, Effects of Orientation on Criticai Heat Flux from Chip Arrays during Flow Boiling, in T. C. William and A. Hiroyuki (eds.), Advances in Electronic Packaging, vol. 1, pp. 123-134, ASME, New York, 1992.
-
(1992)
Advances in Electronic Packaging
, vol.1
, pp. 123-134
-
-
Gersey, C.O.1
Mudawar, I.2
-
8
-
-
0020164116
-
Heat Transfer and Pressure Drop Characteristics of Arrays of Rectangular Modules Encountered in Electronic Equipment
-
E. M. Sparrow, J. E. Niethammer, and A. Chaboki, Heat Transfer and Pressure Drop Characteristics of Arrays of Rectangular Modules Encountered in Electronic Equipment, Int. J. Heat Mass Transfer, vol. 25, pp. 961-973, 1982.
-
(1982)
Int. J. Heat Mass Transfer
, vol.25
, pp. 961-973
-
-
Sparrow, E.M.1
Niethammer, J.E.2
Chaboki, A.3
-
9
-
-
0021980288
-
The Effect of Variations in Stream-wise Spacing and Length on Convection from Surface Mounted Rectangular Components
-
ASME HTD
-
G. L. Lehmann and R. A. Wirtz, The Effect of Variations in Stream-wise Spacing and Length on Convection from Surface Mounted Rectangular Components, in Heat Transfer in Electronic Equipment, ASME HTD-vol. 48, pp. 39-48, 1985.
-
(1985)
Heat Transfer in Electronic Equipment
, vol.48
, pp. 39-48
-
-
Lehmann, G.L.1
Wirtz, R.A.2
-
10
-
-
0025458029
-
Local Forced Convective Heat Transfer from Protruding and Flush-Mounted Two-Dimensional Discrete Heat Sources
-
A. B. McEntire and B. W. Webb, Local Forced Convective Heat Transfer from Protruding and Flush-Mounted Two-Dimensional Discrete Heat Sources, Int. J. Heat Mass Transfer, vol. 33, pp. 1233-1245, 1990.
-
(1990)
Int. J. Heat Mass Transfer
, vol.33
, pp. 1233-1245
-
-
McEntire, A.B.1
Webb, B.W.2
-
11
-
-
0025658760
-
Heat Transfer Characteristics of an Array of Protruding Elements in Single Phase Forced Convection
-
S. V. Garimella and P. A. Eibeck, Heat Transfer Characteristics of an Array of Protruding Elements in Single Phase Forced Convection, Int. J. Heat Mass Transfer, vol. 33, pp. 2659-2669, 1990.
-
(1990)
Int. J. Heat Mass Transfer
, vol.33
, pp. 2659-2669
-
-
Garimella, S.V.1
Eibeck, P.A.2
-
12
-
-
0026220397
-
Effect of Span-wise Spacing on the Heat Transfer from an Array of Protruding Elements in Forced Convection
-
S. V. Garimella and P. A. Eibeck, Effect of Span-wise Spacing on the Heat Transfer from an Array of Protruding Elements in Forced Convection, Int. J. Heat Mass Transfer, vol. 34, pp. 2427-2430, 1991.
-
(1991)
Int. J. Heat Mass Transfer
, vol.34
, pp. 2427-2430
-
-
Garimella, S.V.1
Eibeck, P.A.2
-
13
-
-
0029356441
-
Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices
-
S. V. Garimella and D. J. Schlitz, Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices, ASME J. Heat Transfer, vol. 117, pp. 590-596, 1995.
-
(1995)
ASME J. Heat Transfer
, vol.117
, pp. 590-596
-
-
Garimella, S.V.1
Schlitz, D.J.2
-
14
-
-
0027555076
-
Nucleate Boiling and Critical Heat Flux from Protruded Chip Arrays during Flow Boiling, ASME J
-
C. O. Gersey and I. Mudawar, Nucleate Boiling and Critical Heat Flux from Protruded Chip Arrays during Flow Boiling, ASME J. Electron. Packaging, vol. 115, pp. 78-88, 1993.
-
(1993)
Electron. Packaging
, vol.115
, pp. 78-88
-
-
Gersey, C.O.1
Mudawar, I.2
-
15
-
-
77957099804
-
Thermal Control of Electronic Equipment and Devices
-
G. P. Peterson and A. Ortega, Thermal Control of Electronic Equipment and Devices, Advances in Heat Transfer, vol. 20, pp. 181-314, 1990.
-
(1990)
Advances in Heat Transfer
, vol.20
, pp. 181-314
-
-
Peterson, G.P.1
Ortega, A.2
-
16
-
-
0003366846
-
Direct Liquid Cooling of Micro-electronics Components
-
A. Bar-Cohen and A. D. Kraus (eds.), ASME Press, New York
-
A. E. Bergles and A. Bar-Cohen, Direct Liquid Cooling of Micro-electronics Components, in A. Bar-Cohen and A. D. Kraus (eds.), Advances in Thermal Modeling of Electronic Components and Systems, Vol. 2, pp. 233-342, ASME Press, New York, 1990.
-
(1990)
Advances in Thermal Modeling of Electronic Components and Systems
, vol.2
, pp. 233-342
-
-
Bergles, A.E.1
Bar-Cohen, A.2
-
17
-
-
0026954307
-
Forced-Convection Boiling and Critical Heat Flux from a Linear Array of Discrete Heat Sources
-
T. C. Willingham and I Mudawar, Forced-Convection Boiling and Critical Heat Flux from a Linear Array of Discrete Heat Sources, Int. J. Heat Mass Transfer, vol. 35, pp. 2879-2890, 1992.
-
(1992)
Int. J. Heat Mass Transfer
, vol.35
, pp. 2879-2890
-
-
Willingham, T.C.1
Mudawar, I.2
-
18
-
-
0026839161
-
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: 2—Forced Convection Boiling
-
T. J. Heindel, F. P. Incropera, and S. R. Ramadhyani, Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: 2—Forced Convection Boiling, ASME). Electron. Packaging, vol. 114, pp. 63-70, 1992.
-
(1992)
Asme).Electron. Packaging
, vol.114
, pp. 63-70
-
-
Heindel, T.J.1
Incropera, F.P.2
Ramadhyani, S.R.3
-
19
-
-
0002477246
-
Describing Uncertainties in Single-Sample Experiments
-
R. W. Kline and F. A. McClintock, Describing Uncertainties in Single-Sample Experiments, Mech. Eng., vol. 75, pp. 3-8, 1953.
-
(1953)
Mech. Eng.
, vol.75
, pp. 3-8
-
-
Kline, R.W.1
McClintock, F.A.2
-
20
-
-
85023803832
-
-
Company, Product Manual, Industrial Chemical Products Division, 3M Center, St. Paul, MN
-
Company, Product Manual: Fluorinert Electronic Liquids, Industrial Chemical Products Division, 3M Center, St. Paul, MN, 1986.
-
(1986)
Fluorinert Electronic Liquids
-
-
-
21
-
-
11644291929
-
-
Nanyang Technological University, Singapore, submitted
-
G. P. Xu, Direct Liquid Cooling of Simulated Electronic Chips in a Rectangular Channel, Ph.D. thesis, Nanyang Technological University, Singapore, 1997, submitted.
-
(1997)
Direct Liquid Cooling of Simulated Electronic Chips in a Rectangular Channel, Ph.D. Thesis
-
-
Xu, G.P.1
|