Grinding with directionally aligned SiC whisker wheel - Loading-free grinding

Precision Engineering

Volumn 22, Issue 2, 1998, Pages 59-65

  Yamaguchi, K ^a   Horaguchi, I ^b   Sato, Y ^c  

^a NAGOYA UNIVERSITY   (Japan)

^b TOYOTA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^c Aichi Industrial Research Institute   (Japan)

Author keywords

Abrasive grain; Antiloading; Grinding fluid; Grinding ratio; Loading; Loading free grinding; SiC whisker wheel; Surface roughness

Indexed keywords

ALUMINA; CRYSTAL WHISKERS; GRAIN SIZE AND SHAPE; GRINDING WHEELS; SILICON CARBIDE; SURFACE ROUGHNESS;

LOADING FREE GRINDING;

GRINDING (MACHINING);

EID: 0032040693     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0141-6359(97)00087-1     Document Type: Article

References (3)

1. Yamaguchi, K. and Horaguchi, I. "Development of directionally aligned SiC whisker wheel," Prec Eng, 1995, 17, 5-9
2. Yamaguchi, K. and Horaguchi, I. "Grinding by SiC whisker wheel," Proceedings of the Conference of the Japanese Society of Precision Engineering (JSPE), autumn, 1994, 167
3. Yamaguchi, K. and Horaguchi, I. "Grinding performance of SiC whisker wheel," Proceedings of the Conference of the Japanese Society of Abrasive Technology (ABTEC '94), 1994, 93