Creep of pure aluminium materials at a low temperature

Journal of Materials Science Letters

Volumn 17, Issue 5, 1998, Pages 423-424

  Ishikawa, Keisuke ^a   Okuda, Hiroshi ^a   Kobayashi, Yasuo ^a  

^a TOYO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CREEP TESTING; CRYOGENICS; DIFFUSION IN SOLIDS; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRESS; STRAIN HARDENING; STRAIN RATE; STRESS ANALYSIS; THERMAL EFFECTS;

SHEAR MODULI; TENSILE STRESS;

ALUMINUM;

EID: 0032029018     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006599504441     Document Type: Article

References (6)

1. S. TAKEUCHI and A. S. ARGON, J. Mater. Sci. 11 (1976) 1542.
2. T. A. TIEN and C. T. YEN, Adv. Cryog. Engng 30 (1984) 319.
3. J. WEERTMAN, in "Physical metallurgy", edited by R. W. Chan (North-Holland, Amsterdam, 1965) p. 795.
4. M. F. ASHBY, Acta Metall. 20 (1972) 887.
5. R. W. EVANS and B. WILSHIRE, "Introduction to creep" (Institute of Materials, London, 1993) p. 50.
6. M. F. OROWAN, Z. Phys. 89 (1934) 887.