Improvement in contact resistance characteristics of Ag-Pd alloy due to a third doping agent

IEICE Transactions on Electronics

Volumn E81-C, Issue 3, 1998, Pages 362-368

  Tamai, Terutaka ^a   Ohsaki, Hiroshi ^a   Kawano, Tetsushi ^a  

^a HYOGO UNIVERSITY OF TEACHER EDUCATION   (Japan)

Author keywords

Ag Pd system alloy; Contact failure; Contact resistance; Mg and Cr doping agents

Indexed keywords

CHROMIUM; DOPING (ADDITIVES); ELECTRIC RESISTANCE; ELLIPSOMETRY; MAGNESIUM; OXIDES; SILVER ALLOYS;

CONTACT RESISTANCE;

ELECTRIC CONTACTS;

EID: 0032027714     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (22)

1. T. R. Long and K.F.Bradford, "Contact resistance behavior of the 60Pd-40Ag alloy in tarnishing environments," IEEE Trans. P.H.P., vol. PHP-12, no. 1, pp.29-33, 1976.
2. C. A. Haque, "Metal transfer characteristics in arcing Pd-Ag40wt. percent metal alloy contacts," IEEE Trans. P. H.P, vol. PHP-12, no. I, pp. 15-19, 1976.
3. T. Tanii, Y. Otsuka, K. Toma, and M. Takahashi, "Development of Palladium-Silver contacts," IEICE Trans. vol. J59-C, pp. 662-669, 1976.
4. K. Fujiwara and Y. Yamaguchi, "Adhesion characteristics of Ag-60Pd alloy under extremely short arcs on closure," IEEE Trans. C.H.M.T., vol. CHMT-2, no. 3, pp. 337-342, 1979.
5. W. A. Crossland and P. M. K. Murphy, "The formation of insulating organic films on Palladium-Silver contact alloys," IEEE Trans. P.H.P., vol. PHP-10, no. 1, pp. 64-73, 1974.
6. W. H. Hermance and T. F. Egan, "Organic deposits on precious metal contacts," Bell Syst. Tech. J., vol. 37, pp. 739-777, 1958.
7. M. Antler, M. H. Dozdowicz, and C. A. Haque, "Connector contact materials: Effect of environment on Palladium, Palladium-Silver alloys, and gold electrode-posits," IEEE Trans. C.H.M.T., vol. CHMT-4, no. 4, pp. 482-492, 1981.
8. R. Holm, "Electric Contacts," 4th ed., Springer-Verlag, Berlin, 1976.
9. W. H. Abbott, "The effects of substrate on the contact resistance of tarnish films," IEEE Trans. P.H.P., vol. PHP-8, no. 1, pp. 6-10, 1972.
10. O. Kubaschewski and B. E. Hopkins, "Oxidation of Metals and Alloys," Butterworths, London, 1953.
11. K. Hauffe, "Oxidation of Metals," Plenum Press, New York, 1965.
12. T. Tamai, "Electrical conduction mechanisms of electrical contacts covered with contaminant films," in Surface Contamination, ed. K. L. Mittal, vol. 2, pp. 967-981, Plenum Publishing, New York, 1979.
13. T. Tamai, et al., "Contact resistance characteristics at low temperature," IEEE Trans. C.H.M.T., vol. CHMT-1, no. 1, pp. 54-58, 1978.
14. 2 on contact surface and its effect on contact reliability," IEEE Trans. C.H.M.T., vol. 16, no. 4, pp. 437-441, 1993.
15. T. Tamai and T. Kawano, "Significant decrease in thickness of contaminant films and contact resistance by humidification," IEICE Trans. Electron, vol. E77-C, no. 10, pp. 1614-1620, 1994.
16. T. Tamai, "Growth of oxide films on the surface of Cu contact and its effect on the contact resistance property," Electronics and Communication in Japan, Part 2, vol. 72, no. 7, pp. 87-93, 1989.
17. (in IEICE Trans. vol. J71-C, no. 10, pp. 1347-1354, 1988) .
18. R. M. Azzam and N. M. Bashara, "Ellipsometry and Polarized Light," Amsterdam, The Netherlands, North-Holland, 1987.
19. 2S film and effect of oil film on corrosion resistance Ag contact surface," IEEE Trans. C.H.M.T., vol. 12, no. 1, pp. 43-47, 1989.
20. T. Tamai and K. Kominami, "Ellipsometric analysis for growth of contaminant films on contact surface," IEICE Trans. vol. E70, no. 4, pp. 343-345, 1987.
21. T. Tamai, et al., "Recovery of low level contact resistance based on mechanical removal of contact films," Trans. Inst. Elec. Engrs. Japan, vol. 97, no. 9, pp. 433-440, 1977,
22. in Proc. 8th Internal. Conf. Elec. Contact Phenomena, pp. 95-100, 1976.