Current evolution of electrodeposited copper bumps with photoresist angle

Journal of the Electrochemical Society

Volumn 145, Issue 3, 1998, Pages 840-844

  Kondo, Kazuo ^a,c   Fukui, Keisuke ^b  

^a OKAYAMA UNIVERSITY   (Japan)

^b UNIVERSITY OF HYOGO   (Japan)

^c ELECTROCHEMICAL SOCIETY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; COMPUTATIONAL FLUID DYNAMICS; COPPER; CURRENT DENSITY; DIFFUSION; NUMERICAL ANALYSIS; PHOTORESISTS;

CURRENT DISTRIBUTION;

ELECTRODEPOSITION;

EID: 0032023623     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838354     Document Type: Article

References (15)

1. R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook, p. 361, Van Nostrand Reinhold, New York (1989).
2. Y. Yamamoto, M. Sugimoto, and K. Miyake, in Proceedings of ISHM '93, p. 370, Dallas, TX (1993).
3. K. Hatada, Introduction to TAB Technology, Kougiyou-chiyousakai, Tokyo (1989).
4. R. C. Alkire and H. Deligianni, This Journal, 135, 1093 (1988).
5. R. C. Alkire, and H. Deligianni, and J-B. Ju, ibid., 137, 818 (1990).
6. M. Georgiadou and R. C. Alkire, ibid., 140, 1340 (1993).
7. M. Georgiadou and R. C. Alkire, ibid., 140, 1348 (1993).
8. M. Georgiadou and R. C. Alkire, ibid., 141, 679 (1994).
9. R. V. Shenoy and M. Datta, ibid., 143, 544 (1996).
10. J. O. Dukovic, IBM J. Res. Develop., 37, 125 (1993).
11. K. Kondo, T. Miyazaki, and Y. Tamura, This Journal, 141, 1644 (1994).
12. K. Kondo and K. Fukui, Kagaku Kogaku Ronbunshu, 22, (1996).
13. K. Kondo, K. Fukui, K. Uno, and K. Shinohara, This Journal, 143, 466 (1997).
14. K. Kondo, K. Fukui, M. Yokoyama, and K. Shonohara, ibid., 144, 466 (1997).
15. S. V. Patankar, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corp., New York (1980).