A new leadframe design solution for improved popcorn cracking performance

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 1, 1998, Pages 3-12

  Lee, Charles ^a,b   Wong, Teck Chin ^b   Pape, Heinz ^c  

^a IEEE   (Germany)

^b Packaging Technology   (Singapore)

^c SIEMENS AG   (Germany)

Author keywords

Adhesion; Atomic force microscopy; Contact angle; Finite element analysis; Force measurements; Improved popcorn performance; Leadframe design; Package stresses; Plasma cleaning; Thermal resistance

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; COPPER ALLOYS; CRACK INITIATION; DELAMINATION; FINITE ELEMENT METHOD; HEAT RESISTANCE; MATHEMATICAL MODELS; PLASMA APPLICATIONS; STRESSES; SURFACE CLEANING;

CONTACT ANGLE METHOD; LEADFRAME DESIGN; PLASMA CLEANING; POPCORN CRACKING SENSITIVITY; QUAD FLAT PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032021894     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.679025     Document Type: Article

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