Fabrication and Thermal Properties of Polyimide/Cu Functionally Graded Material

Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy

Volumn 45, Issue 3, 1998, Pages 216-219

  Omori, Mamoru ^a   Okubo, Akira ^a   Hirai, Toshio ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Functionally graded material; Residual stress; Spark plasma system; Thermal conductivity; Thermal expansion mismatch; Thermoplastic polyimide

Indexed keywords

ALUMINUM COMPOUNDS; CERAMIC MATERIALS; COMPOSITE MATERIALS; COPPER; COPPER POWDER; POLYIMIDES; POWDER METALS; POWDERS; RESIDUAL STRESSES;

ALUMINUM NITRIDE POWDER; FUNCTIONALLY GRADED MATERIAL; SPARK PLASMA SYSTEM;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 0032019394     PISSN: 05328799     EISSN: None     Source Type: Journal    
DOI: 10.2497/jjspm.45.216     Document Type: Article

References (6)

1. C.E. Sroog: J. Polyp. Sci. Macromol. Revs., 11(1976) 161.
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3. M. Omori, A. Okubo, G.H. Kang and T, Hirai: "Preparation and Properties of Polyimide/Cu Functionally Graded Material", Functionally Graded Materials 1996, I. Shiota and Y. Miyamoto ed., Tsukuba, Japan, Elsevier, (1997) 767-772.
4. Mitsui Toatsu Co. Ltd.: Catalogue of Polyimide (Aurum).
5. M. Omori, A. Okubo, K. Gilhan and T. Hirai: "Consolidation of Thermosetting Polyimide by the Spark Plasma System", J. Mater. Synth. Proc., 5(1977) 279-282.
6. T. Hirai: "Functional Gradient Materials", Materials Science and Technology, Processing of Ceramics, Part 2, VHC Verlagssellschaft mbH, Germany, (1996) 293-341.