The attachment of thin alumina ceramic plates to kovar® using gold germanium solder

Engineering Failure Analysis

Volumn 5, Issue 1, 1998, Pages 69-75

  Matsuoka, D ^a   Smith, M ^a   Es Said, O S ^a  

^a LOYOLA MARYMOUNT UNIVERSITY   (United States)

Author keywords

Defects; Electronic device failures; Joint failures; Non destructive inspection; Production failures

Indexed keywords

CERAMIC PRODUCTS; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; NONDESTRUCTIVE EXAMINATION; SOLDERING; X RAY SPECTROSCOPY;

ELECTRONIC DEVICE FAILURES; JOINT FAILURES; SOLDERING DEFECTS;

SOLDERED JOINTS;

EID: 0032010608     PISSN: 13506307     EISSN: None     Source Type: Journal    
DOI: 10.1016/s1350-6307(97)00017-4     Document Type: Article

References (3)

1. Humpston, G., Principles of Soldering and Brazing. ASM International, Materials Park, Ohio, 1993.
2. Lee, C., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989, 12(3).
3. Winkle, R., Substrate Soldering in Microwave Hybrid Integrated Circuit Assembly. Philips Research Laboratories, Redhill, Surrey, U.K., 1990.