Analysis of process errors and production yield for surface mounted printed circuit assembly

Journal of Electronics Manufacturing

Volumn 8, Issue 1, 1998, Pages 51-72

  Linn, Richard J ^a   Lam, Ming Mui ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CONCURRENT ENGINEERING; ERROR ANALYSIS; MATHEMATICAL MODELS; MONTE CARLO METHODS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PROCESS CONTROL; PRODUCTION CONTROL; QUALITY ASSURANCE; SURFACE MOUNT TECHNOLOGY;

PROCESS ERROR MODELS;

PRINTED CIRCUIT BOARDS;

EID: 0032010225     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313198000057     Document Type: Article

References (22)

1. W. E. Wilhelm and J. Fowler, "Research directions in electronics manufacturing", IIE Transactions 24(4) (1992), 6-17.
2. S. W. Hinch, Handbook of Surface Mount Technology, New York, Longman Scientific and Technical, John Wiley and Sons, Inc., 1988.
3. J. H. Lau, Handbook Of Fine Pitch Surface Mount Technology, New York: Van Nostrand Reinhold, 1994.
4. P. P. Marcoux, Fine Pitch Surface Mount Technology: Quality, Design and Manufacturing Techniques, New York: Van Nostrand Reinhold, 1992.
5. F. Riley (ed.) , The Electronics Assembly Handbook, New York: IFS Publications/Springer-Verlag, 1988.
6. C. Capillo, "Designing reliability into surface mount assemblies", ed. F. Riley and the Staff of Electronic Packaging and Production, The Electronics Assembly Handbook, New York: IFS Publications/Springer-Verlag, 1988.
7. P. S. Grundy, "Surface mount technology assembly: Quality and reliability in placement", Advancing Surface Mount Technology, An IPS Executive Briefing, IPS Publication, Springer-Verlag, 1988.
8. S. P. Sun and F.-J. Wu, "Alignment technique for high precision pick and place in electronic packaging", IEEE/CHMT Thirteenth International Electronics Manufacturing Technology Symposium, 1992, p. 361.
9. D. J. Spigarelli, "A new approach to precision placement of fine pitch devices: Automated vision during placement delivers high accuracy while reducing system complexity", Electronic Packaging and Production 1991, 68-71.
10. L. Cox, "Wave soldering: A study in process control", ed. F. Riley and the Staff of Electronic Packaging and Production, The Electronics Assembly Handbook, New York: IPS Publications/Springer-Verlag, 1988.
11. J. R. Ellis and G. Y. Masada, "Dynamic behavior of SMT chip capacitors during solder reflow", IEEE Seventh International Electronic and Manufacturing Technology Symposium, 1989, pp. 23-29.
12. N. Goel, K. S. Kalaichelvan and B. Blewer, "A statistical method to integrate manufacturing tolerance in high speed digital circuit design", IEEE/CHMT 11th International Electronics Manufacturing Technology Symposium, 1991, pp. 395.
13. R. W. Kolowitz, "Compliance metrics for surface mount component lead design", Proceedings of 1990 IEEE Electronic Components and Technology Conference, Las Vegas, NV, 1990, Vol. 2, pp. 21-23.
14. R. W. Kolowitz and L. R. Taylor, "Compliance metrics for the inclined gull-wing, spider J-bend and spider gull wing lead, design for surface mount components", IEEE Transactions on Components, Hybrids and Manufacturing Technology 14(4) (1991), 771-779.
15. M. Deley, C. Ramsey and D. Smith, "Putting fine-pitch errors on a budget", Circuits Manufacturing (1990), 40-45.
16. G. Nobel and J. Gleason, "Tolerance issues in SMT assembly", Proceedings of the Technical Program. 1991 Surface Mount International Conference and Exposition, San Jose, CA, USA 1991, pp. 266-273.
17. C. E. Bauer and J. M. DeCarlo, "Precision placement of high lead count electronic packages", Circuit Assembly (1992), 39-41.
18. R. J. K. Wassink, "Footprints of fine pitch SMDs", Circuit World 18(2) (1992), 5-11.
19. W. R. Shih, Y.-W. Huang, K. Srihari and G. R. Westby, "Estimation of yield through component placement accuracy in surface mount PWB assembly", Computers and Industrial Engineering 29(1-4) (1995), 607-611.
20. R. J. Linn, "Component placement error model for surface mounted technology", Proceedings of 1996 Industrial Engineering Research Conference, Minneapolis, Minnesota, 1996, pp. 91-96.
21. J. C. Walsh, "Impact of manufacturing tolerances on fine pitch device placement", Proceedings of the Technical Program. NEPCON East '89, 1989, pp. 237-246.
22. A. M. Law and W. D. Kelton, Simulation Modeling and Analysis, McGraw-Hill, Inc., 1991, pp. 462-521.