Sensitivity of piezoelectric wafers to the curing of thermoset resins and thermoset composites

Smart Materials and Structures

Volumn 7, Issue 1, 1998, Pages 113-120

  Wang, Xiaoming ^a   Ehlers, Claus ^b   Kissinger, Christian ^b   Neitzel, Manfred ^b   Ye, Lin ^a   Mai, Yiu Wing ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

^b INSTITUT FÜR VERBUNDWERKSTOFFE GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CURING; DAMPING; ELASTIC MODULI; ELECTRIC RESISTANCE; GELATION; INDUCTANCE MEASUREMENT; SENSITIVITY ANALYSIS; THERMOSETS; TRANSFER FUNCTIONS; VIBRATIONS (MECHANICAL); VISCOSITY OF LIQUIDS;

PIEZOELECTRIC WAFERS;

PIEZOELECTRIC DEVICES;

EID: 0032000353     PISSN: 09641726     EISSN: None     Source Type: Journal    
DOI: 10.1088/0964-1726/7/1/013     Document Type: Article

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