Numerical modeling of a clock distribution network for a superconducting multichip module

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 98-104

  Vichot, Paul ^b   Mix, Jason A ^b   Schoenborn, Zale ^c   Dunn, John ^b   Piket May, Melinda ^a,b  

^a IEEE

^b UNIVERSITY OF COLORADO   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Clock distribution; Finite difference time domain; Finite element; Multichip module; Superconducting

Indexed keywords

COMPUTER SIMULATION; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; JOSEPHSON JUNCTION DEVICES; MATHEMATICAL MODELS; MULTICHIP MODULES; SWITCHING NETWORKS; TIME DOMAIN ANALYSIS;

CLOCK DISTRIBUTION NETWORKS; CROSSBAR SWITCHES;

TIMING CIRCUITS;

EID: 0031999972     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659512     Document Type: Article

References (11)

1. L. Licciardi et al., "A multichip module solution for high-performance atm switching," Tech. Rep. 4, CSELT, Torino, Italy, Aug. 1996.
2. J. Hagge, "State of the art multichip modules in avionics," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 15, p. 25, 1992.
3. R. R. Tummala, H. R. Potts, and S. Ahmed, "Packaging technology for IBM's latest mainframe computers," in Proc. 41th Electron. Comp. Technol. Conf., 1991, pp. 682-688.
4. Mehta et al., "Supersparc multichip module," in Proc. IEEE Multichip Module Conf., 1993, pp. 19-22.
5. N. Sherwani, Q. Yu, and S. Badida, Introduction to Multichip Modules New York: Wiley, 1995.
6. S. Sercu and L. Martens, "A new algorithm for experimental circuit modeling of interconnection structures based on causality," IEEE Trans. Comp., Packag. Manufact. Technol., vol. 19, pp. 289-295, May 1996.
7. H. You and M. Soma, "Analysis and simulation of multiconductor transmission lines for high speed interconnect and package design," IEEE Trans. Comp., Hybrids Manufact. Technol., vol. 13, pp. 839-845, Dec. 1990.
8. D. Nayak, L. T. Hwang, and I. Turlik, "Calculation of electrical parameters of a thin-film multichip package," IEEE Trans. Comp., Hybrids Manufact. Technol., vol. 12, pp. 303-309, June 1989.
9. S.-Y. Yu and F.-L. Chao, "Signal distortion and em radiation of clock distribution net on multichip module," in Proc. IEEE Int. Symp. Electromag. Compat., 1991, pp. 416-417.
10. A. D. Friedman and P. R. Menon, Theory and Design of Switching Circuits. Woodland Hills, CA: Computer Science, 1975.
11. K. C. Gupta and M. D. Abouzahra, Eds., Analysis and Design of Planar Microwave Components. New York: IEEE Press, 1994.