Etching residues of sputtered Ta film using chlorine-based plasma

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 37, Issue 2 SUPPL. B, 1998, Pages

  Iba, Yoshihisa ^a   Kumasaka, Fumiaki ^a   Takeda, Masayuki ^a   Aoyama, Hajime ^a   Yamabe, Masaki ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Etching residue; RIE; SiC; Sputtering; Ta; X ray absorber; X ray mask

Indexed keywords

ETCHING; FILMS; SILICON CARBIDE; SPUTTERING; TANTALUM;

MICROHOLES; RESIDUES;

PLASMA APPLICATIONS;

EID: 0031999895     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.37.L251     Document Type: Article

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