New design for a lead frame used for high pin counts and high-power LSI package

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 43-52

  Mita, Mamoru ^a   Takagi, Shoji ^a   Kumakura, Toyohiko ^a   Yamaguchi, Kenzi ^a   Tanaka, Hiroki ^a  

^a HITACHI CABLE LTD   (Japan)

Author keywords

Flexible circuit; Lead frame; LSI; LSI package; Soldering; TAB

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC GROUNDING; ELECTRIC IMPEDANCE; ELECTRIC INSULATION; ETCHING; HEAT RESISTANCE; HEAT TRANSFER; INTEGRATED CIRCUIT MANUFACTURE; LSI CIRCUITS; PRINTED CIRCUITS; SOLDERING;

DIELECTRIC INSULATION; LEAD FRAMES;

ELECTRONICS PACKAGING;

EID: 0031999512     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659505     Document Type: Article

References (9)

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