Cause and effect of void formation during vacuum bag curing of epoxy film adhesives

Journal of Adhesion Science and Technology

Volumn 12, Issue 6, 1998, Pages 567-584

  Pearce, P J ^a   Arnott, D R ^a   Camilleri, A ^a   Kindermann, M R ^a   Mathys, G I ^a   Wilson, A R ^a  

^a AERO AND MAR RESEARCH LABORATORY   (Australia)

Author keywords

Durability; Epoxy film adhesives; Mechanical properties; Vacuum bag curing; Void formation

Indexed keywords

BOND STRENGTH (MATERIALS); CURING; DEGASSING; DURABILITY; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; ORGANIC SOLVENTS; WATER; ADHESIVE JOINTS; ADHESIVES; KETONES; MECHANICAL PROPERTIES; TENSILE STRENGTH; VACUUM;

COMPUTERIZED PIXEL COUNTING TECHNIQUE; VACUUM BAG CURING; VOID CONTENT;

PLASTIC ADHESIVES; CURING;

ADHESIVELY BONDED JOINTS; ATMOSPHERIC WATER; BOND DURABILITY; DURABILITY TEST; EFFECT OF VOIDS; EPOXY FILM ADHESIVES; EPOXY FILMS; FTIR SPECTROSCOPY; IN-SITU; METHYL ETHYL KETONES; PEEL STRENGTH; POTENTIAL SOURCES; QUANTITATIVE ESTIMATION; VIDEO IMAGE; VOID CONTENTS; VOID FORMATION; VOLATILE PRODUCTS;

EID: 0031703846     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856198X00795     Document Type: Article

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